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MICRO USB 5P B-F SMT CL=4.15(加长脚2.0)
1. MATERIAL
HOUSING: LCP,UL94V
CONTACT: COPPER ALLOY,
SHELL:STAINLESS STEEL,T=0.3
COVER:STAINLESS STEEL,T=0.25
2. FINISH
CONTACT: 50U" MIN NICKEL UNDERPLATING OVERALL
GOLD PLATING SELECTIVE ON CONTACT AREA
50U" MIN TIN PLATING ON SOLDER TAIL
SHELL: 40U" MIN NICKEL UNDERPLATING OVERALL
COVER: 40U" MIN NICKEL UNDERPLATING OVERALL
3. ELECTRICAL
CURRENT: 1.0A
VOLTAGE: 30V
CONTACT RESISTANCE: 50 MILLIOHMS MAX.
DIELECTRIC WITHSTANDING VOLTAGE: 500V AC
INSULATION RESISTANCE: 100 MEGOHMS MIN.
4. MECHANICAL
MATING FORCE: 35N MAX
UNMATING FORCE: 10N MIN,INITIAL
8~20N AFTER 10000 CYCLES.
URABILITY: 10000 CYCLES
5. PRODUCT NO. DESCRIPTION:
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